Flexible Printed Circuits Design & Source Control Services
Miraco's mission is to provide comprehensive engineering and global sourcing services specializing in flexible interconnect systems. Miraco provides design engineering, documentation, procurement, supply chain management and specialized added value services. We focus on meeting the program goals of environmental, electrical, mechanical and cost objectives while providing a balanced solution.
Miraco's engineering design team, specialized added value services, quality control lab and test equipment located in Manchester, NH combined with FPC manufacturers, both foreign and domestic, provides our customers with the complete solution that anticipates the issues encountered during the product life cycle:
In-house Engineering Design Team
In-house Quality Control Lab
Domestic partners who specialize in quick turn prototypes, production volumes and ITAR requirements
Offshore partners where Miraco can transparently move the manufacturing to a low cost region while still maintaining quality controls
Miraco's expertise in all forms of interconnect solutions provides customers with flexible printed circuit designs that meet the many constraints system architects place on their designs.
Design & Sourcing Capabilities
Together, We Can Connect the Inner Systems
ENGINEERING:
200 plus combined years of design and manufacturing experience with all FPC and other interconnect solutions
Knowledge derived from 30+ patents in the field of flex interconnects and connector technology
Complete engineering support takes the customer from design and testing to manufacturing
Full documentation on Miraco’s or customer’s format
SOURCE CONTROL MANAGEMENT:
Miraco leverages its combined flex circuit purchases to achieve the best lead time and lowest material cost to benefit all our customers
Miraco creates, controls and provides complete “READY FOR MANUFACTURING” documentation and data packages
Miraco can seamlessly dual source applications to assure program delivery requirements
Miraco exceeds conventional quality control practices to insure all parts are built to print
Miraco has the systems and procedures in place to accommodate your preferred scheduling requirements such as: Kanban, JIT, Ship-to-Stock
Assembly services provided by Miraco using approved and qualified contract manufacturers
Internally used process, competent technical understanding
Total Solution provider
Improve reliability while enhancing performance
Improved overall system value
Ideal for low temperature applications
Safe for delicate electronic applications
RoHS Compliant
Machines in Miraco North and Miraco South
Product Capabilities
DISPLAY INTERCONNECT SYSTEMS
100 OHM differential pairs
EMI control
Active component assemblies with custom laminated stiffeners
INTERNAL DISC DRIVE
Impedence controlled, 50 OHM single ended
Highly flexible construction
Accommodates various ZIF thicknesses
CUSTOM CONNECTION INTERFACE
Flexible interconnect conversions available
Configurable to any board terminator
Custom connector designs available
LOGIC INTERFACE
Rigid-flex design
Suitable for pick and place SMT
Can be supplied in panel form with breakouts
BOARD-TO-BOARD INTERCONNECT SYSTEM
High density BGA connectors
Isolated layer pairs for additional flexibility
High density: Up to 10 layers
Design Formats
Autocad (DXF, DWG), Gerber (RS274-X) Solid Works (IGES, SLDPRT)
Panel Size
24" Maximum Width, 10' + Length
Covercoat Thickness
.005-up
Layer Count
1-18
Interconnect Assembly Types
Thru Hole
SMT, BGA, Hybrid FFC/FPC
Finished Hole Size
Compliant Pinned (rigid zone only) Via (A/R dependent)
0.018" (0.457mm)
0.008" (0.203mm)
Internal Features (Copper Weight Dependent)
Trace
Spacing
0.003" (0.0762mm)
0.003" (0.0762mm)
Materials
Polymide -= Standard Acrylic / Epoxy
Polymide - FR Acrylic / Epoxy
Polymide - AP
Silver Epoxy Shielding
Soldermask
FR-4/21 & 24
Copper Processing
1/4 oz. .032"
Impedance Single & Differential
+/- 10 % GHZ
Surface Finishes
HASL
OSP- Entek 106
ENIG
Immersion Tin
Immersion Silver
Bright Tin
Ni/Au
Assembly Capabilities
Full Turn-Key
Thru-hole- Wave & Manual
SMT - Pick & Place
Wire-bond
Crimp
RoHS Compliance
Custom Connection (interconnection forming)
Test Capabilities
Impedance Testing
Hi-Pot up to 5,000 VDC
2,000+ points per circuit
Insulation Resistance up to 500 VDC
Four Wire Kelvin .001 & up
IPC-TM-650 (Env-Mech Testing)
X-Ray Composition Analysis
Plating Thickness
Bed of Nails
Flying Probe
Flex Cycling
Environmental
Functional Test
LED's, Diodes, Resistance Capacitors
Mfg. Standards
IPC-6013 Class I, II and III; Types 1-5
Mil-P50884 Types 1-5
AS9100 Certification