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Quick Laser Design Tip #1



When designing a flexible circuit panel for laser processing, it is very important to properly select the type and locations for the optical targets used for registration. The type of target shall be dictated by the required tolerances, available space, and the material type.

The type of target shall be dictated by the required tolerances, available space, and the material type. The lasered features can only be positioned as accurately as the targets so it is critical that the optical targets are consistent. For example, a drilled registration hole with a drill to etch registration tolerance of +/-0.005" cannot be used to locate a ZIF outline which requires an outline to etch registration of +/-0.003" since the lasered outline will be accurate to the drilled feature and not the etched feature.

To achieve the best results, we recommend using an etched hole up to 0.150" diameter in the same copper layer as the critical features of the circuit, visible from the side of the panel that is being lasered, and with a larger etched clearance on any other copper layers.

These registration features can be covered on both sides with polyimide insulation, covered on one side, left bare, or plated. If a drilled coverfilm exposure is provided for the target, the exposure should be large enough to sufficiently to expose a square area around the target that is a minimum of 1.5 times the etched hole diameter and is free of coverfilm and adhesive.

As a general rule, if the targets are easily visible with the naked eye with consistent appearance and without the aid of special lighting, they will be visible to the vision system.

For more information please review Miraco's Quick Laser Flex-Circuit Design Guide or contact a Miraco sales representative with your questions.

 

 

 

 

 

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